TY - GEN
T1 - Interfacial engineering of sot-mram to modulate atomic diffusion and enable pma stability >400 °c
AU - Bi, Chong
AU - Lin, Shy Jay
AU - Li, Xiang
AU - Simsek, Telem
AU - Song, M.
AU - Tsai, Wilman
AU - Wang, Shan X.
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/4
Y1 - 2019/4
N2 - We report our work on the optimization of W/CoFeB/MgO structures to fulfill perpendicular magnetic anisotropy (PMA) requirements in the production of SOT-MRAM. By optimizing the natural oxidization process of deposited Mg layer and introducing different dust layers at W/CoFeB and CoFeB/MgO interfaces, PMA of W/CoFeB/MgO structures can be enhanced by about 100%, which is much higher than that in Ta-based structures. The origin of this PMA enhancement was further confirmed by transmission electron microscopy investigations. The corresponding SOT switching efficiency and current-induced effective fields were also investigated.
AB - We report our work on the optimization of W/CoFeB/MgO structures to fulfill perpendicular magnetic anisotropy (PMA) requirements in the production of SOT-MRAM. By optimizing the natural oxidization process of deposited Mg layer and introducing different dust layers at W/CoFeB and CoFeB/MgO interfaces, PMA of W/CoFeB/MgO structures can be enhanced by about 100%, which is much higher than that in Ta-based structures. The origin of this PMA enhancement was further confirmed by transmission electron microscopy investigations. The corresponding SOT switching efficiency and current-induced effective fields were also investigated.
UR - https://www.scopus.com/pages/publications/85072107366
UR - https://www.webofscience.com/api/gateway?GWVersion=2&SrcApp=performanshacettepe&SrcAuth=WosAPI&KeyUT=WOS:000503374900025&DestLinkType=FullRecord&DestApp=WOS_CPL
U2 - 10.1109/VLSI-TSA.2019.8804669
DO - 10.1109/VLSI-TSA.2019.8804669
M3 - Conference contribution
AN - SCOPUS:85072107366
T3 - 2019 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2019
BT - 2019 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2019
Y2 - 22 April 2019 through 25 April 2019
ER -